Study of Mixed-signal crosstalk in 3-D package

With the development of miniaturization, multi-function, environmental protection and other aspects of electronic products, high-density integration technology such as System-on-Chip (SOC) and System-in-Package (SIP) technology has developed rapidly. Mixed-signal integrity in multi-chip integration packages is a main issue. To meet the demand for high-density, 3-D chip stacking is one solution to reduce size and increase the integration. In this paper, three methods are implemented and contrasted: (1) sweep the stack sequence of RF chip and digital chip; (2) investigate the crosstalk with or without adding shielding layer to the stacked dies; (3) investigate the crosstalk with varying the density of ground points on the shielding.