Title :
Performance of silver-glue attachment technology in assembly
Author :
Wang, Mu-Chun ; Huang, Kuo-Shu ; Hsieh, Zhen-Ying ; Yang, Hsin-Chia ; Liu, Chuan-Hsi ; Lin, Chii-Ruey
Author_Institution :
Dept. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxy-resin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.
Keywords :
assembling; flip-chip devices; resins; assembly; die-attachment process; epoxy-resin diffusion; final package performance; flip-chip package; lead-frame; silver paste; silver-glue attachment technology; sticking process; wire bonding; Adhesives; Assembly; Electronics packaging; Lead; Magnetic heads; Shape; Silver;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5583797
