DocumentCode
2300943
Title
Chip-scale optical interconnects based on hybrid integrated multiple quantum well devices
Author
Gu, Tian ; Nair, Rohit ; Haney, Michael W.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
fYear
2012
fDate
23-27 Sept. 2012
Firstpage
276
Lastpage
277
Abstract
Hybrid integrated chip-scale optical interconnects based on small-footprint coupling to surface-normal MQW devices are advanced. Refinements to the grayscale lithographic fabrication process provide a path to ultra-high-density seamless interfacing between the on- and off-chip domains.
Keywords
integrated circuit interconnections; lithography; optical interconnections; quantum well devices; chip scale optical interconnects; grayscale lithographic fabrication process; hybrid integrated multiple quantum well devices; surface normal multiple quantum well; ultrahigh density seamless interfacing; Couplers; Modulation; Optical coupling; Optical interconnections; Optical waveguides; Quantum well devices; Silicon; Optical Interconnects; Photonic Integrated Circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics Conference (IPC), 2012 IEEE
Conference_Location
Burlingame, CA
Print_ISBN
978-1-4577-0731-5
Type
conf
DOI
10.1109/IPCon.2012.6358599
Filename
6358599
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