• DocumentCode
    2302692
  • Title

    Reducing Delay Uncertainty of On-Chip Interconnects by Combining Inverting and Non-Inverting Repeaters Insertion

  • Author

    Akl, Charbel J. ; Bayoumi, Magdy A.

  • Author_Institution
    Center for Adv. Comput. Studies, Louisiana Univ., Lafayette, LA
  • fYear
    2007
  • fDate
    26-28 March 2007
  • Firstpage
    219
  • Lastpage
    224
  • Abstract
    Coupling capacitances between neighboring wires have a significant effect on performance and delay uncertainty of on-chip interconnects in deep submicron (DSM) technologies. We propose combining inverting and non-inverting repeater insertion to achieve a constant effective coupling capacitance for all possible input transitions. Unlike staggered repeater scheme, the increased wire resistance does not have any effect on our technique, and the performance is less sensitive to repeater placement variation. Simulations at the 90-nm node on a semi-global METAL5 layer show around 25% reduction in worst case delay and 86% delay uncertainty minimization
  • Keywords
    CMOS integrated circuits; coupled circuits; integrated circuit interconnections; 90 nm; coupling capacitances; deep submicron technologies; delay uncertainty; inverting repeater insertion; noninverting repeater insertion; on-chip interconnects; repeater placement variation; semi-global METAL5 layer; staggered repeater scheme; wire resistance; CMOS technology; Capacitance; Crosstalk; Degradation; Delay effects; Repeaters; Routing; Timing; Uncertainty; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2007. ISQED '07. 8th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-2795-7
  • Type

    conf

  • DOI
    10.1109/ISQED.2007.134
  • Filename
    4149037