DocumentCode
2302692
Title
Reducing Delay Uncertainty of On-Chip Interconnects by Combining Inverting and Non-Inverting Repeaters Insertion
Author
Akl, Charbel J. ; Bayoumi, Magdy A.
Author_Institution
Center for Adv. Comput. Studies, Louisiana Univ., Lafayette, LA
fYear
2007
fDate
26-28 March 2007
Firstpage
219
Lastpage
224
Abstract
Coupling capacitances between neighboring wires have a significant effect on performance and delay uncertainty of on-chip interconnects in deep submicron (DSM) technologies. We propose combining inverting and non-inverting repeater insertion to achieve a constant effective coupling capacitance for all possible input transitions. Unlike staggered repeater scheme, the increased wire resistance does not have any effect on our technique, and the performance is less sensitive to repeater placement variation. Simulations at the 90-nm node on a semi-global METAL5 layer show around 25% reduction in worst case delay and 86% delay uncertainty minimization
Keywords
CMOS integrated circuits; coupled circuits; integrated circuit interconnections; 90 nm; coupling capacitances; deep submicron technologies; delay uncertainty; inverting repeater insertion; noninverting repeater insertion; on-chip interconnects; repeater placement variation; semi-global METAL5 layer; staggered repeater scheme; wire resistance; CMOS technology; Capacitance; Crosstalk; Degradation; Delay effects; Repeaters; Routing; Timing; Uncertainty; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2007. ISQED '07. 8th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7695-2795-7
Type
conf
DOI
10.1109/ISQED.2007.134
Filename
4149037
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