DocumentCode :
2302979
Title :
Variation Analysis of CAM Cells
Author :
Mupid, Amol ; Mutyam, Madhu ; Vijaykrishnan, N. ; Xie, Y. ; Irwin, M.J.
Author_Institution :
Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA
fYear :
2007
fDate :
26-28 March 2007
Firstpage :
333
Lastpage :
338
Abstract :
Process related variations are considered a major concern in emerging sub-65nm technologies. In this paper, we investigate the impact of process variations on different types of content addressable memories (CAM). As CAM structures are used in various on-chip structures such as caches and TLBs, understanding process variation impact of CAM structures is important. To gain insight on the relative importance of process variation effects, we also examine the effect of variability due to temperature and supply voltage changes. Our results show that the NAND-type CAM cells are more susceptible to failures as compared to NOR-type CAM cells. Finally, we propose an architectural technique to mitigate the performance degradation effects of process variation. The proposed technique yields an average of 37.5%, 25% and 12.5% reduction in CAM occupancy for caches with 25%, 50% and 75% variation respectively, over SPEC 2000 CPU benchmarks as compared to a worst-case design in the presence of process variation
Keywords :
content-addressable storage; logic design; manufacturing processes; NAND-type CAM cells; NOR-type CAM cells; SPEC 2000 CPU benchmarks; architectural technique; content addressable memories; on-chip structures; performance degradation effects; process variation impact; variation analysis; worst-case design; Application software; Associative memory; CADCAM; Computer aided manufacturing; Computer science; Degradation; Information analysis; Information technology; Plasma temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2007. ISQED '07. 8th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-2795-7
Type :
conf
DOI :
10.1109/ISQED.2007.166
Filename :
4149057
Link To Document :
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