Title :
Radiation tolerant intelligent memory stack (RTIMS)
Author :
Ng, Tak-kwong ; Herath, Jeffrey A.
Author_Institution :
NASA Langley Res. Center, Hampton, VA
Abstract :
The radiation tolerant intelligent memory stack (RTIMS), suitable for both geostationary and low Earth orbit missions, has been developed. The memory module is fully functional and undergoing environmental and radiation characterization. A self-contained "flight-like" module is expected to be completed in 2006. RTIMS provides reconfigurable circuitry and 2 gigabits of error corrected or 1 gigabit of triple redundant digital memory in a small package. RTIMS utilizes circuit stacking of heterogeneous components and radiation shielding technologies. A reprogrammable field programmable gate array (FPGA), six synchronous dynamic random access memories, linear regulator, and the radiation mitigation circuitries are stacked into a module of 42.7mm times 42.7mm times13.00mm. Triple module redundancy, current limiting, configuration scrubbing, and single event function interrupt detection are employed to mitigate radiation effects. The mitigation techniques significantly simplify system design. RTIMS is well suited for deployment in real-time data processing, reconfigurable computing, and memory intensive applications
Keywords :
DRAM chips; field programmable gate arrays; radiation effects; redundancy; space research; space vehicle electronics; storage management chips; RTIMS; circuit stacking; flight-like module; geostationary mission; heterogeneous components; linear regulator; low Earth orbit missions; memory module; radiation mitigation circuitries; radiation shielding technologies; radiation tolerant intelligent memory stack; reprogrammable field programmable gate array; synchronous dynamic random access memories; Circuits; Current limiters; Error correction; Field programmable gate arrays; Low earth orbit satellites; Packaging; Redundancy; Regulators; SDRAM; Stacking;
Conference_Titel :
Space Mission Challenges for Information Technology, 2006. SMC-IT 2006. Second IEEE International Conference on
Conference_Location :
Pasadena, CA
Print_ISBN :
0-7695-2644-6
DOI :
10.1109/SMC-IT.2006.63