DocumentCode :
2303340
Title :
SilcVerify: An Efficient Substrate Coupling Noise Simulation Tool for High-Speed & Nano-Scaled Memory Design
Author :
Kim, Jeong-Yeol ; Shin, Ho-Soon ; Lee, Jong-Bae ; Yoo, Moon-Hyun ; Kong, Jeong-Taek
Author_Institution :
Semicond. R&D Center, Samsung Electron., Seoul
fYear :
2007
fDate :
26-28 March 2007
Firstpage :
475
Lastpage :
480
Abstract :
In this paper, the authors propose a switch-level substrate noise simulation tool named SilcVerify for high-speed memory design based on lightly-doped and nanoscaled CMOS processes. It uses the device switching model (DSM) as its noise source and the adjacent geometry dependent macromodel (AGDM) as its substrate model. The DSM represents the noise injection of each transistor into the substrate. It consists of one current source and one capacitance. The AGDM is a scalable model based on the layout geometry and Voronoi tessellation. Consequently, a sparse network composed with DSMs and AGDMs is solved by using a linear system solution technique. Experimental results for real designs verify that SilcVerify can simulate three orders larger circuits and two orders faster than the reference method using a 3D substrate model and a nonlinear circuit simulator while maintaining the accuracy of about 10% error. SilcVerify can be applied to block placement and guard-ring optimization for PLL jitter reduction
Keywords :
CMOS memory circuits; high-speed integrated circuits; integrated circuit modelling; integrated circuit noise; nanoelectronics; phase locked loops; CMOS process; PLL jitter reduction; SilcVerify; adjacent geometry dependent macromodel; device switching model; guard-ring optimization; high-speed memory design; nanoscaled memory design; substrate coupling noise; CMOS process; Capacitance; Circuit simulation; Geometry; Jitter; Linear systems; Nonlinear circuits; Phase locked loops; Semiconductor device modeling; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2007. ISQED '07. 8th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-2795-7
Type :
conf
DOI :
10.1109/ISQED.2007.144
Filename :
4149080
Link To Document :
بازگشت