DocumentCode :
230365
Title :
Investigation of lumped-parameter thermal model and thermal parameters test for IPMSM
Author :
Wenbo Wang ; Yubin Zhou ; Yangsheng Chen
Author_Institution :
Coll. of Electron. Eng., Zhejiang Univ., Hangzhou, China
fYear :
2014
fDate :
22-25 Oct. 2014
Firstpage :
3246
Lastpage :
3252
Abstract :
A lumped-parameter thermal network accounting for mounting plate is established to predict temperature rise of interior permanent magnet synchronous motors (IPMSM). With an improved DC thermal test proposed in this paper, some important thermal parameters in the thermal network are estimated, such as the equivalent thermal resistance between housing and ambient, the equivalent thermal conductivity between winding and lamination and the thermal interface gap between housing and lamination and so on. With the thermal network, the temperature of every motor component can be predicted. The performance of the thermal model is validated by finite element analysis (FEA) and experiments on test motors. In addition, the thermal model sensitivity to key thermal parameters is studied. The research can offer references for motor design and motor thermal analysis.
Keywords :
finite element analysis; lumped parameter networks; permanent magnet motors; synchronous motors; thermal conductivity; thermal management (packaging); thermal resistance; DC thermal test; FEA; IPMSM; equivalent thermal conductivity; equivalent thermal resistance; finite element analysis; interior permanent magnet synchronous motors; lumped-parameter thermal model; motor component; motor thermal analysis; thermal interface gap; thermal model sensitivity; thermal network; thermal parameters test; Lamination; Stator windings; Thermal analysis; Thermal conductivity; Thermal resistance; IPMSM; lumped-parameter thermal model; sensitivity analysis; steady and transient state temperature prediction; thermal parameter determination;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Machines and Systems (ICEMS), 2014 17th International Conference on
Conference_Location :
Hangzhou
Type :
conf
DOI :
10.1109/ICEMS.2014.7014052
Filename :
7014052
Link To Document :
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