ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges

Author

Liu, Johan

Author_Institution

Dept. of Product Eng., Chalmers Univ. of Technol., Goteborg, Sweden

fYear

2000

fDate

2000

Firstpage

1

Lastpage

15

Abstract

Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out

Keywords

adhesives; failure analysis; flip-chip devices; integrated circuit bonding; packaging; surface mount technology; ACA bonding technology; SMT; anisotropically conductive adhesives; bare chip attach; chemical behaviour; contactless smart-card module assembly; cost behaviour; electrical behaviour; environmental behaviour; flexible substrates; flip-chip attach; glass substrate; low cost electronics packaging applications; physical behaviour; rigid substrates; thermal behaviour; Anisotropic magnetoresistance; Assembly; Bonding; Chemical technology; Conductive adhesives; Contacts; Costs; Electronic packaging thermal management; Electronics packaging; Glass;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on

Conference_Location

Espoo

Print_ISBN

0-7803-6460-0

Type

conf

DOI

10.1109/ADHES.2000.860564

Filename

860564