Title :
Concepts for ultra thin packaging technologies
Author :
Aschenbrenner, R. ; Ansorge, F. ; Feil, M. ; Landesberger, Ch ; Jung, E. ; Ostmann, A. ; Reichl, H.
Author_Institution :
Fraunhofer-Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
Abstract :
As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP´s to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP´s, 3D modules and volumetric integration of passive and active components into modules and substrates
Keywords :
chip scale packaging; flip-chip devices; integrated circuit packaging; microassembling; multichip modules; 3D modules; CSP; MCM; assembly processes; flexible assemblies; flexible chips; substrates; ultra thin packaging technologies; ultra-thin chips; volumetric integration; Assembly; Chip scale packaging; Costs; Displays; Electronic packaging thermal management; Electronics packaging; Flexible manufacturing systems; Integrated circuit packaging; Polymers; Smart cards;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860565
