DocumentCode
2304068
Title
Adhesion performance and thermo-mechanical property of epoxy-based underfill
Author
Luo, Shijian ; Yamashita, Tsuyoshi ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2000
fDate
2000
Firstpage
70
Lastpage
76
Abstract
The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine<imidazole derivatives<cobalt acetylacetonate. The bulk properties of the systems were studied through a thermo-mechanical analyzer (TMA). Epoxy resins cured with different catalysts showed different glass transition temperatures (Tg) and coefficients of thermal expansion (CTE). Among them, the CAA catalyzed systems showed the highest Tg and low CTE. Due to the cycloaliphatic structure of the ERL4221 resin, the cured ERL4221 systems showed the highest Tg compared to the other systems with the same catalysts. EPON8281 systems generally had lower moisture absorption than the other epoxy systems. The surface tension of the underfills was measured. The adhesion strength was evaluated by a die shear test with SiO2 and Si 3N4 (SiN) passivated silicon dies as substrates
Keywords
adhesion; ageing; delamination; encapsulation; integrated circuit packaging; passivation; polymers; surface tension; thermal expansion; Si3N4; SiO2; adhesion performance; adhesion strength; bisphenol A type; bisphenol F type; catalysts; coefficients of thermal expansion; curing peak temperature; curing profiles; cycloaliphatic type; die shear test; epoxy resins; epoxy-based underfill; flow behavior; glass transition temperatures; moisture absorption; passivated dies; thermo-mechanical property; Adhesives; Cobalt; Computer aided analysis; Curing; EPON; Epoxy resins; Glass; Temperature; Thermal expansion; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860576
Filename
860576
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