• DocumentCode
    2304068
  • Title

    Adhesion performance and thermo-mechanical property of epoxy-based underfill

  • Author

    Luo, Shijian ; Yamashita, Tsuyoshi ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    70
  • Lastpage
    76
  • Abstract
    The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine<imidazole derivatives<cobalt acetylacetonate. The bulk properties of the systems were studied through a thermo-mechanical analyzer (TMA). Epoxy resins cured with different catalysts showed different glass transition temperatures (Tg) and coefficients of thermal expansion (CTE). Among them, the CAA catalyzed systems showed the highest Tg and low CTE. Due to the cycloaliphatic structure of the ERL4221 resin, the cured ERL4221 systems showed the highest Tg compared to the other systems with the same catalysts. EPON8281 systems generally had lower moisture absorption than the other epoxy systems. The surface tension of the underfills was measured. The adhesion strength was evaluated by a die shear test with SiO2 and Si 3N4 (SiN) passivated silicon dies as substrates
  • Keywords
    adhesion; ageing; delamination; encapsulation; integrated circuit packaging; passivation; polymers; surface tension; thermal expansion; Si3N4; SiO2; adhesion performance; adhesion strength; bisphenol A type; bisphenol F type; catalysts; coefficients of thermal expansion; curing peak temperature; curing profiles; cycloaliphatic type; die shear test; epoxy resins; epoxy-based underfill; flow behavior; glass transition temperatures; moisture absorption; passivated dies; thermo-mechanical property; Adhesives; Cobalt; Computer aided analysis; Curing; EPON; Epoxy resins; Glass; Temperature; Thermal expansion; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
  • Conference_Location
    Espoo
  • Print_ISBN
    0-7803-6460-0
  • Type

    conf

  • DOI
    10.1109/ADHES.2000.860576
  • Filename
    860576