Title :
Electrically conductive polyaniline adhesive
Author :
Pietila, Mikko ; Makela, Tapio ; Levon, Kalle ; Kivilahti, Jorma ; Isotalo, Meikki
Author_Institution :
VTT Microelectronics, Espoo, Finland
Abstract :
Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured
Keywords :
adhesives; conducting materials; electrical conductivity; tensile strength; transparency; 1 S/cm; UV-initiator; conducting material; conductivity values; dodecylbenzenesulfonic acid doped polyaniline; electrically conductive polyaniline adhesive; highly transparent films; methacrylate/acrylate monomers; tensile strength; thermal properties; Chemical technology; Conducting materials; Conductive adhesives; Curing; Electrical resistance measurement; Electrodes; Glass; Gold; Semiconductor device measurement; Thermal conductivity;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860584
