• DocumentCode
    2304203
  • Title

    Electrically conductive polyaniline adhesive

  • Author

    Pietila, Mikko ; Makela, Tapio ; Levon, Kalle ; Kivilahti, Jorma ; Isotalo, Meikki

  • Author_Institution
    VTT Microelectronics, Espoo, Finland
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    118
  • Lastpage
    120
  • Abstract
    Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured
  • Keywords
    adhesives; conducting materials; electrical conductivity; tensile strength; transparency; 1 S/cm; UV-initiator; conducting material; conductivity values; dodecylbenzenesulfonic acid doped polyaniline; electrically conductive polyaniline adhesive; highly transparent films; methacrylate/acrylate monomers; tensile strength; thermal properties; Chemical technology; Conducting materials; Conductive adhesives; Curing; Electrical resistance measurement; Electrodes; Glass; Gold; Semiconductor device measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
  • Conference_Location
    Espoo
  • Print_ISBN
    0-7803-6460-0
  • Type

    conf

  • DOI
    10.1109/ADHES.2000.860584
  • Filename
    860584