DocumentCode
2304203
Title
Electrically conductive polyaniline adhesive
Author
Pietila, Mikko ; Makela, Tapio ; Levon, Kalle ; Kivilahti, Jorma ; Isotalo, Meikki
Author_Institution
VTT Microelectronics, Espoo, Finland
fYear
2000
fDate
2000
Firstpage
118
Lastpage
120
Abstract
Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured
Keywords
adhesives; conducting materials; electrical conductivity; tensile strength; transparency; 1 S/cm; UV-initiator; conducting material; conductivity values; dodecylbenzenesulfonic acid doped polyaniline; electrically conductive polyaniline adhesive; highly transparent films; methacrylate/acrylate monomers; tensile strength; thermal properties; Chemical technology; Conducting materials; Conductive adhesives; Curing; Electrical resistance measurement; Electrodes; Glass; Gold; Semiconductor device measurement; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860584
Filename
860584
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