• DocumentCode
    2304225
  • Title

    Recent advances in electrically conductive adhesives for electronics applications

  • Author

    Wong, C.P. ; Lu, Daoqiang

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    121
  • Lastpage
    128
  • Abstract
    As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology
  • Keywords
    adhesives; ageing; conducting materials; contact resistance; electrical conductivity; impact strength; contact resistance; electrical conductivity; electrically conductive adhesives; electronics applications; elevated temperature aging; humidity aging; impact performance; Batteries; Conducting materials; Conductive adhesives; Conductivity; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Polymers; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
  • Conference_Location
    Espoo
  • Print_ISBN
    0-7803-6460-0
  • Type

    conf

  • DOI
    10.1109/ADHES.2000.860585
  • Filename
    860585