DocumentCode
2304225
Title
Recent advances in electrically conductive adhesives for electronics applications
Author
Wong, C.P. ; Lu, Daoqiang
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2000
fDate
2000
Firstpage
121
Lastpage
128
Abstract
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology
Keywords
adhesives; ageing; conducting materials; contact resistance; electrical conductivity; impact strength; contact resistance; electrical conductivity; electrically conductive adhesives; electronics applications; elevated temperature aging; humidity aging; impact performance; Batteries; Conducting materials; Conductive adhesives; Conductivity; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Polymers; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860585
Filename
860585
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