DocumentCode :
2304225
Title :
Recent advances in electrically conductive adhesives for electronics applications
Author :
Wong, C.P. ; Lu, Daoqiang
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2000
fDate :
2000
Firstpage :
121
Lastpage :
128
Abstract :
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology
Keywords :
adhesives; ageing; conducting materials; contact resistance; electrical conductivity; impact strength; contact resistance; electrical conductivity; electrically conductive adhesives; electronics applications; elevated temperature aging; humidity aging; impact performance; Batteries; Conducting materials; Conductive adhesives; Conductivity; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Polymers; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
Type :
conf
DOI :
10.1109/ADHES.2000.860585
Filename :
860585
Link To Document :
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