Title :
Lowest variability SOI FinFETs having multiple Vt by back-biasing
Author :
Matsukawa, T. ; Fukuda, Kenji ; Liu, Y.X. ; Endo, Kazuhiro ; Tsukada, J. ; Yamauchi, Hiroyuki ; Ishikawa, Yozo ; O´uchi, S. ; Mizubayashi, W. ; Migita, S. ; Morita, Yusuke ; Ota, Hiroyuki ; Masahara, M.
Author_Institution :
Nanoelectron. Res. Inst., AIST, Tsukuba, Japan
Abstract :
FinFETs with an amorphous metal gate (MG) are fabricated on silicon-on-thin-buried-oxide (SOTB) wafers for realizing both low variability and tunable threshold voltage (Vt) necessary for multiple Vt solution. The FinFETs with an amorphous TaSiN MG record the lowest on-state drain current (Ion) variability (0.37 %μm) in comparison to bulk and SOI planar MOSFETs thanks to the suppressed variability of Vt (AVt=1.32 mVμm), drain induced barrier lowering (DIBL) and trans-conductance (Gm). Back-biasing through the SOTB provides excellent Vt controllability keeping the low Vt variability in contrast to Vt tuning by fin channel doping.
Keywords :
MOSFET; semiconductor device reliability; silicon-on-insulator; tantalum compounds; SOTB wafers; TaSiN; amorphous metal gate; back biasing technique; drain induced barrier lowering; lowest variability SOI FinFET; on-state drain current variability; silicon-on-thin buried oxide; tunable threshold voltage; Doping; FinFETs; Fluctuations; Tin; Tuning; Very large scale integration;
Conference_Titel :
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4799-3331-0
DOI :
10.1109/VLSIT.2014.6894393