Title :
Effect of cure temperature on impact resistance of conductive adhesives
Author :
MacDavitt, Sean R. ; Morris, James E.
Author_Institution :
T.J. Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA
Abstract :
The experiments described look at the impact resistance of conductive adhesives. A standard drop test from 5 feet was used to test the adhesives. The goal of the experiments was to determine whether the adhesives successfully passed these tests. The effects of cure temperature on the mechanical bond of the adhesive are discussed as well. The focus of the results is on the effect of cure temperature on adhesion
Keywords :
adhesion; adhesives; impact strength; plastic packaging; 5 feet; adhesion; conductive adhesives; cure temperature; impact resistance; mechanical bond; standard drop test; Absorption; Aluminum; Bonding; Conductive adhesives; Copper; Curing; Electric resistance; Electronics packaging; Temperature; Testing;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860605
