DocumentCode
2304629
Title
Model for the leakage instability in unprogrammed amorphous silicon antifuse devices
Author
Nicollian, Paul E. ; Hunter, William R.
Author_Institution
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
fYear
1995
fDate
4-6 April 1995
Firstpage
42
Lastpage
47
Abstract
The leakage instability of hydrogenated amorphous silicon (H:a-Si) antifuse devices is one of the important reliability aspects of this new technology, because it determines the standby power for circuit applications. A physical model of the leakage instability is described. After highly accelerated voltage stress, the transport mechanism for the saturated state is shown to be hopping conduction through trap states near the Fermi level. Trap densities on the order of 1/spl times/10/sup 20/ eV/sup -1/ cm/sup -3/ can be induced through stress. This model can be used to facilitate antifuse technology development.
Keywords
amorphous semiconductors; elemental semiconductors; field programmable gate arrays; hopping conduction; hydrogen; leakage currents; life testing; reliability theory; semiconductor device models; semiconductor device reliability; semiconductor device testing; silicon; FPGA circuits; Fermi level; Si:H; amorphous Si:H antifuse; antifuse technology; highly accelerated voltage stress; hopping conduction; leakage instability model; physical model; reliability aspects; saturated state; standby power; transport mechanism; trap densities; trap states; unprogrammed amorphous Si antifuse devices; Acceleration; Amorphous silicon; Bonding; Leakage current; Plasma applications; Plasma devices; Plasma temperature; Semiconductor process modeling; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2031-X
Type
conf
DOI
10.1109/RELPHY.1995.513651
Filename
513651
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