DocumentCode :
230488
Title :
In0.53Ga0.47As quantum-well MOSFET with source/drain regrowth for low power logic applications
Author :
Zhou, Xiaoxin ; Alian, A. ; Mols, Y. ; Rooyackers, R. ; Eneman, Geert ; Lin, Dongyang ; Ivanov, T. ; Pourghaderi, Ali ; Collaert, Nadine ; Thean, A.
Author_Institution :
Imec, Leuven, Belgium
fYear :
2014
fDate :
9-12 June 2014
Firstpage :
1
Lastpage :
2
Abstract :
This paper reports In0.53Ga0.47As quantum-well MOSFET with source/drain regrowth for logic applications. For a device with Lg=100nm and EOT of 1.1nm, Ion=550μA/μm at 0.5V and fixed Ioff=100nA/μm, peak gm,ext=2.21mS/μm, and SS=82mV/dec at Vds=0.5V are obtained. Minimum SS at Vds=0.5V remains 80-87mV/dec for all gate lengths from 500nm to 75nm. To our knowledge, these are the best planar InGaAs-channel MOSFETs in literature. We attribute these advances to the improvement in epitaxy especially the InAlAs buffer, III-V/oxide interface engineering, and source/drain regrowth. A process has been developed to improve dielectric/III-V interface. The effects of EOT scaling on device performance are studied.
Keywords :
III-V semiconductors; MOSFET; indium compounds; logic devices; low-power electronics; quantum well devices; semiconductor-insulator boundaries; EOT scaling; In0.53Ga0.47As; InAlAs; InP; dielectric-semiconductor interface; equivalent oxide thickness scaling; low power logic applications; planar channel MOSFET; quantum well MOSFET; source-drain regrowth; Benchmark testing; Dielectrics; Indium gallium arsenide; Indium phosphide; Logic gates; MOSFET; Metals;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4799-3331-0
Type :
conf
DOI :
10.1109/VLSIT.2014.6894419
Filename :
6894419
Link To Document :
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