Title :
Solder ball connection reliability model and critical parameter optimization
Author :
Phelan, G. ; Wang, S.
Abstract :
Surface mount array packages have been qualified by IBM for up to 625 I/O. Array packages are difficult to inspect and cannot be repaired at card assembly. Therefore, in order to ensure reliable joints, the critical process parameters have been determined. A model was obtained in which the reliability of the product can be predicted from actual build values of the critical parameters. Control of the critical parameters can ensure product quality
Keywords :
Assembly; Capacitive sensors; Ceramics; Electronics industry; Electronics packaging; Lead; Predictive models; Space technology; Surface-mount technology; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346683
