DocumentCode :
2304939
Title :
Laser processing of adhesives and polymeric materials for microelectronics packaging applications
Author :
Illyefalvi-Vitez, Zsolt
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
fYear :
2000
fDate :
2000
Firstpage :
289
Lastpage :
295
Abstract :
The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymers, including electrically and/or thermally conductive and insulating polymeric adhesives, for functional insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well. Laser processing of polymeric materials applied for via generation image transfer, contour cutting, etc. has proved to be an efficient tool for the fabrication of interconnects substrates. The paper describes the results of research projects that are aimed at the application of CO2 and frequency multiplied Nd:YAG lasers for the drilling of polyester foils and glass fiber reinforced epoxy laminates with the aim of interconnect via preparation. The physics of processing using five wavelengths, i.e. 10600, 1064, 532, 355 and 266 nm, were modeled, examined and evaluated. Through contacting was carried out by screen-printing with polymer thick films, by wet chemical direct plating and by evaporation of thin metal layers, but the details of metallization are not given here. The conclusion refers to the possibilities and limitations of laser processing of polymeric materials in microelectronics packaging applications
Keywords :
adhesives; conducting polymers; integrated circuit interconnections; integrated circuit packaging; laminates; laser materials processing; multichip modules; polymer films; 266 to 10600 nm; CO2; CO2 lasers; MCM; YAG:Nd; YAl5O12:Nd; contour cutting; electrically conductive polymeric adhesives; frequency multiplied Nd:YAG lasers; glass fiber reinforced epoxy laminates; insulating polymeric adhesives; interconnect substrate fabrication; interconnect via preparation; laser ablation; laser drilling; laser processing; microelectronics packaging applications; polyester foils; polymer thick films; polymeric materials; protective layers; screen printing; thermally conductive polymeric adhesives; thin metal layer evaporation; via generation image transfer; wet chemical direct plating; Costs; Dielectrics and electrical insulation; Integrated circuit interconnections; Laser beam cutting; Laser modes; Microelectronics; Optical materials; Plastic insulation; Polymers; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
Type :
conf
DOI :
10.1109/ADHES.2000.860622
Filename :
860622
Link To Document :
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