• DocumentCode
    2305004
  • Title

    Failure analysis mechanisms of miniaturized multilayer ceramic capacitors under normal service conditions

  • Author

    Chan, Y.C. ; Yeung, F.

  • Author_Institution
    Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    1152
  • Lastpage
    1155
  • Abstract
    The authors report on failure analysis results on miniaturized multilayer ceramic capacitors (`0402´, `0603´, `0805´, and `1206´ sizes) which have been subjected to various degrees of thermal shock up to 450°C by ice-water or dry-ice quenching. The thermal shock resistance of `0402´ multilayer ceramic capacitors is found to be about 400°C and considerably better than that of the larger ones. Microstructural and layer-by-layer insulation resistance analyses have clearly identified the physical locations responsible for the electrical leakage of defective capacitors. No evidence of silver migration as a dominant failure mechanism has been observed for any of the defective capacitors under usual operating stresses. Comparisons of I-V characteristics for multilayer ceramic capacitors quenched by ice water and dry ice confirm that water plays a significant role in causing electrical failure at nominal bias. Failure mechanisms are then proposed to explain the failure of miniaturized multilayer ceramic capacitors under normal service conditions
  • Keywords
    ceramic capacitors; characteristics measurement; electrical faults; electronic equipment testing; failure analysis; life testing; quenching (thermal); thermal shock; thermal stress cracking; 400 to 450 degC; I-V characteristics; dry-ice quenching; electrical failure; electrical leakage; failure analysis mechanisms; ice-water quenching; insulation resistance analyses; miniaturized multilayer ceramic capacitors; normal service conditions; thermal shock; thermal shock resistance; Capacitors; Ceramics; Electric resistance; Electric shock; Failure analysis; Ice; Nonhomogeneous media; Thermal quenching; Thermal resistance; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346689
  • Filename
    346689