Roadmap “Adhesives Technologies in Automotive and Harsh Environment Applications”

Within the European Thematic Network “Adhesives in Electronics” a Roadmap has been prepared to establish the present status of adhesive use in automotive electronics and to find out the most important requirements for the future. Presently non and isotropically conductive adhesives are used for die bonding and underfills for solder flip chip processes. The biggest challenge for automotive electronics is the harsh environment that results in demands on device and materials reliability. Processing aspects such as short curing times are also an important criteria in material selection. In addition, the materials should be low cost