DocumentCode :
230505
Title :
Germanium-Tin on Silicon avalanche photodiode for short-wave infrared imaging
Author :
Yuan Dong ; Wei Wang ; Xin Xu ; Xiao Gong ; Dian Lei ; Qian Zhou ; Zhe Xu ; Soon-Fatt Yoon ; Gengchiau Liang ; Yee-Chia Yeo
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
fYear :
2014
fDate :
9-12 June 2014
Firstpage :
1
Lastpage :
2
Abstract :
The first demonstration of Germanium-Tin on Silicon (Ge1-xSnx/Si) avalanche photodiode (APD) for short-wave infrared (SWIR) imaging is reported. The temperature dependence of breakdown voltage was characterized. An extracted thermal coefficient of 0.05% K-1 indicates that the Ge1-xSnx/Si APD achieved a lower thermal sensitivity than conventional III-V-based APDs. At the wavelength λ of 1600 to 1630 nm, a responsivity of ~ 1 A/W (bias voltage Vbias = -9.7 V) was achieved due to the internal avalanche gain of Ge1-xSnx/Si/Si APD. The monolithic and CMOS-compatible Ge1-xSnx/Si APD presented here shows promise in SWIR imaging applications where low-cost and high sensitivity sensing arrays are needed.
Keywords :
avalanche breakdown; avalanche photodiodes; germanium; infrared imaging; sensitivity analysis; silicon; tin; APD; CMOS-compatible APD; Ge1-xSnx-Si; SWIR imaging; breakdown voltage; germanium-tin on silicon avalanche photodiode; high sensitivity sensing array; internal avalanche gain; monolithic APD; short-wave infrared imaging; thermal coefficient; thermal sensitivity; wavelength 1600 nm to 1630 nm; Absorption; Imaging; PIN photodiodes; Silicon; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4799-3331-0
Type :
conf
DOI :
10.1109/VLSIT.2014.6894428
Filename :
6894428
Link To Document :
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