A heuristic force-height equation for molten axisymmetric solder joints

Author

Goldman, L.S.

Author_Institution

IBM Corp., Hopewell Junction, NY

fYear

1993

fDate

1-4 Jun 1993

Firstpage

1120

Lastpage

1124

Abstract

A heuristic equation is developed which relates the height of a molten joint to its surface tension, geometric constraints, and the applied force. In its present state, the equation is valid only for heights varying up to 10% from the zero-load shape, although a method is suggested to extend this range. The equation agrees well with published data derived from an exact solution, and with the data from a small laboratory experiment. The equation is intended as a practical tool for packaging engineers and designers who do not have access to the software needed to obtain the exact solution

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit packaging; soldering; surface mount technology; surface tension; SMT; applied force; flip chip attachment; geometric constraints; heuristic force-height equation; molten axisymmetric solder joints; packaging engineers; solder interconnections; surface tension; zero-load shape; Electronics industry; Equations; Fatigue; Flip chip; Force measurement; Laboratories; Shape measurement; Soldering; Surface tension; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346694

Filename

346694