• DocumentCode
    2305163
  • Title

    The preparation and electrical conduction of Li2SnO3 thick film humidity sensitive material

  • Author

    Zhang, J.L. ; Lu, Y.D. ; Li, B.R. ; Meng, J.L.

  • Author_Institution
    Dept. of Solid State Electron., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    1095
  • Lastpage
    1098
  • Abstract
    Li2SnO3 thick film was fabricated as a humidity-sensitive material with high sensitivity, low temperature coefficient and humidity hysteresis, and long-time stability. The humidity sensitivity and electrical conduction under different values of relative humidity were investigated. The complex impedance spectrum of the materials was measured and a non-Debye model was introduced to study the conduction mechanism. The linear and inclined semi-circle complex impedance diagrams were observed in vacuum and environmental humidities, respectively. The equivalent parameters were calculated and related to the different regions in the materials, namely, grain, grain surface, and electrode surface. The results indicate that the main conduction carriers are H+ and Li+, and that the grain resistance is nearly independent of the relative humidity, whereas the resistance of the grain surface decreases with increasing relative humidity
  • Keywords
    dielectric relaxation; electric resistance; humidity measurement; humidity sensors; ionic conductivity; lithium compounds; thick film devices; tin compounds; Li2SnO3; Li2SnO3 thick film; complex impedance diagrams; complex impedance spectrum; conduction mechanism; electrical conduction; electrode surface; grain resistance; grain surface; humidity hysteresis; humidity sensitive material; long-time stability; nonDebye model; temperature coefficient; Conducting materials; Electrodes; Humidity; Hysteresis; Impedance measurement; Stability; Surface impedance; Surface resistance; Temperature sensors; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346698
  • Filename
    346698