Title :
Enhanced MCM-C package performance by formation of improved 3-D interconnections
Author :
Sarfaraz, M.A. ; Tong, Cunsheng ; Yau, You-Wen
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
The authors introduce an improved 3-D interconnection fabricating technology which uses an electron beam to generate surface trenches in green ceramic sheets for the interconnection wirings. The electron beam is capable of generating narrow lines as well as high-density wiring patterns. Electron-beam-formed line cross-sections (line width and thickness) can be adjusted for electrical performance optimization. CMOS and ECL (emitter coupled logic) drivers require different optimized transmission line characteristics for high-performance digital systems. It is shown how the interconnection´s cross-sectional dimensions can be controlled by electron-beam machining. Computer simulation results on the range of electrical characteristics achievable in these interconnects as the line space and line cross-section are varied are shown
Keywords :
electron beam machining; integrated circuit interconnections; multichip modules; thick film circuits; 3D interconnection fabrication technology; CMOS drivers; ECL drivers; MCM-C package performance; computer simulation; electrical performance optimization; electron-beam machining; green ceramic sheets; high-density wiring patterns; high-performance digital systems; interconnection cross-sectional dimensions; interconnection wirings; line width; optimized transmission line characteristics; surface trenches; CMOS logic circuits; CMOS technology; Ceramics; Couplings; Digital systems; Electron beams; Optimization; Packaging; Transmission lines; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346703