Approaches to cost reducing MCM-D substrate fabrication

Author

Tessier, T.G. ; Myszka, E.G.

Author_Institution

Corp. Manuf. Res. Center, Motorola Inc., Schaumburg, IL, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

570

Lastpage

578

Abstract

This paper outlines strategies to cost reduce MCM-D substrate fabrication. A simplification of an existing excimer laser via generation process is outlined. The feasibility of using large panel processing equipment borrowed from the LCD industry for the processing of panel sizes up to 500 mm×500 mm is assessed in a preliminary study, and a cost model is presented. Results presented indicate that significant cost reductions can be obtained in going to LCD panel sizes for MCM-D processing provided volumes are in excess of 250 K 50 mm×50 mm substrate equivalents per year

Keywords

economics; laser ablation; multichip modules; photolithography; 50 to 500 mm; MCM-D substrate; cost model; cost reductions; excimer laser; large panel processing equipment; laser ablation; panel sizes; photoresists; substrate fabrication; via generation process; Availability; Costs; Dielectric substrates; Laser modes; Manufacturing industries; Manufacturing processes; Multichip modules; Optical device fabrication; Pulp manufacturing; Semiconductor process modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346710

Filename

346710