DocumentCode :
2305448
Title :
Approaches to cost reducing MCM-D substrate fabrication
Author :
Tessier, T.G. ; Myszka, E.G.
Author_Institution :
Corp. Manuf. Res. Center, Motorola Inc., Schaumburg, IL, USA
fYear :
1993
fDate :
1-4 Jun 1993
Firstpage :
570
Lastpage :
578
Abstract :
This paper outlines strategies to cost reduce MCM-D substrate fabrication. A simplification of an existing excimer laser via generation process is outlined. The feasibility of using large panel processing equipment borrowed from the LCD industry for the processing of panel sizes up to 500 mm×500 mm is assessed in a preliminary study, and a cost model is presented. Results presented indicate that significant cost reductions can be obtained in going to LCD panel sizes for MCM-D processing provided volumes are in excess of 250 K 50 mm×50 mm substrate equivalents per year
Keywords :
economics; laser ablation; multichip modules; photolithography; 50 to 500 mm; MCM-D substrate; cost model; cost reductions; excimer laser; large panel processing equipment; laser ablation; panel sizes; photoresists; substrate fabrication; via generation process; Availability; Costs; Dielectric substrates; Laser modes; Manufacturing industries; Manufacturing processes; Multichip modules; Optical device fabrication; Pulp manufacturing; Semiconductor process modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
Type :
conf
DOI :
10.1109/ECTC.1993.346710
Filename :
346710
Link To Document :
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