Title :
Fabrication of thin film multilayer substrate using copper clad polyimide sheets
Author :
Miyazaki, K. ; Takahashi, A. ; Miura, O. ; Watanabe, R. ; Satsu, E. ; Miwa, T. ; Katagiri, J.
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
Abstract :
A novel fabrication process is proposed for thin film multilayer substrates. The feature of the process involves the lamination of polyimide sheets with previously inspected wiring patterns. Several technical points were investigated during development of the process. Fairly large dimensional changes occur in the polyimide sheets in the copper etching and lamination steps. However, these changes can be restrained by fixing the sheets to rigid frames. Excimer laser ablation is a useful method to form blind via holes with a high aspect ratio. These holes can be metallized successfully by electroless copper plating
Keywords :
electroless deposition; etching; laminates; packaging; wiring; aspect ratio; blind via holes; copper clad polyimide sheets; dimensional changes; electroless copper plating; etching; excimer laser ablation; fabrication process; lamination; rigid frames; thin film multilayer substrate; wiring patterns; Copper; Etching; Fabrication; Lamination; Laser ablation; Nonhomogeneous media; Polyimides; Substrates; Transistors; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346712
