Transient thermal impedance tester for power IC packages

Author

Patel, V. ; Mak, W.C. ; Rice, B. ; Feinstein, L.

Author_Institution

Allegro MicroSystems Inc., Worcester, MA, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

289

Lastpage

294

Abstract

A transient thermal impedance tester design and its general capabilities are presented. Transient temperature measurements on several power IC packages are obtained. Transient responses of the package subjected to repetitive pulses and to a complex transient power pulse are presented. Temperature measurements on a test chip are compared with the solution as obtained from transient thermal finite element analysis. The effects of measurement delay time on junction temperature measurement are discussed

Keywords

delays; finite element analysis; integrated circuit packaging; integrated circuit testing; power integrated circuits; temperature measurement; thermal resistance; thermal resistance measurement; transient analysers; transient response; complex transient power pulse; junction temperature measurement; measurement delay time; power IC packages; repetitive pulses; thermal finite element analysis; transient response; transient temperature measurements; transient thermal impedance tester; Delay effects; Finite element methods; Impedance; Integrated circuit packaging; Integrated circuit testing; Power integrated circuits; Semiconductor device measurement; Temperature measurement; Time measurement; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346715

Filename

346715