Title :
Transient thermal impedance tester for power IC packages
Author :
Patel, V. ; Mak, W.C. ; Rice, B. ; Feinstein, L.
Author_Institution :
Allegro MicroSystems Inc., Worcester, MA, USA
Abstract :
A transient thermal impedance tester design and its general capabilities are presented. Transient temperature measurements on several power IC packages are obtained. Transient responses of the package subjected to repetitive pulses and to a complex transient power pulse are presented. Temperature measurements on a test chip are compared with the solution as obtained from transient thermal finite element analysis. The effects of measurement delay time on junction temperature measurement are discussed
Keywords :
delays; finite element analysis; integrated circuit packaging; integrated circuit testing; power integrated circuits; temperature measurement; thermal resistance; thermal resistance measurement; transient analysers; transient response; complex transient power pulse; junction temperature measurement; measurement delay time; power IC packages; repetitive pulses; thermal finite element analysis; transient response; transient temperature measurements; transient thermal impedance tester; Delay effects; Finite element methods; Impedance; Integrated circuit packaging; Integrated circuit testing; Power integrated circuits; Semiconductor device measurement; Temperature measurement; Time measurement; Transient analysis;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346715
