Fatigue life prolongation effect of low frequency on 40Pb-60Sn solder

Author

Otsuka, Kanji ; Taneda, Motoharu ; Kasukawa, A. ; Shirai, Yuji ; Miwa, Takashi ; Kitano, Makoto

Author_Institution

Fac. of Eng., Yamaguchi Univ., Ube, Japan

fYear

1993

fDate

1-4 Jun 1993

Firstpage

997

Lastpage

1003

Abstract

The lifetime of 40Pb-60Sn solder joints is generally dominated by creep deformation, because of slow strain rate in field uses. To explain this behavior, a torsional fatigue cycle test was carried out under isothermal conditions. A lower strain range for the creep deformation prolonged the life because the lattice vibration energy seemed to restore the defects during reciprocal cycle motion. The estimation of life from creep deformation is shown to be a more accurate approach for estimating field life

Keywords

creep testing; fatigue; fatigue testing; lead alloys; life testing; reliability; soldering; tin alloys; torsion; 40Pb-60Sn solder; PbSn; creep deformation; fatigue life prolongation; field life; isothermal conditions; lattice vibration energy; reciprocal cycle motion; reliability; solder joints; strain range; torsional fatigue cycle test; Capacitive sensors; Creep; Equations; Fatigue; Frequency; Isothermal processes; Life estimation; Life testing; Soldering; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346731

Filename

346731