Title :
Fiber-optic interconnect and component packaging for the next generation of aerospace platforms
Author_Institution :
Harris Corp., Melbourne, FL, USA
Abstract :
The author first presents an overview of the requirements for data communication subsystems in modern, high-performance military aircraft and spacecraft, in order to put a perspective on the issues and challenges. The evolution of the needed fiber-optic components such as transmitters, receivers, and interconnection hardware is presented. This leads to a description of the state of the art in aerospace optoelectronic packaging, as it is practised at the Harris Corporation. The author concludes with a list of promising optical and optoelectronic technologies expected to be found in future avionic subsystems
Keywords :
aircraft communication; aircraft instrumentation; data communication systems; military systems; optical communication equipment; optical interconnections; optical links; optical receivers; packaging; space communication links; Harris Corporation; aerospace optoelectronic packaging; aerospace platforms; avionic subsystems; component packaging; data communication subsystems; fiber-optic interconnect; fiber-optic receivers; fiber-optic transmitters; interconnection hardware; military aircraft; spacecraft; Aerospace electronics; Data communication; Hardware; Military aircraft; Optical fiber communication; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Space vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346735