Title :
A comparison of modelling methods for electronic interconnect structures
Author :
Ogunjimi, A.O. ; Whalley, David C. ; Williams, D.J.
Author_Institution :
Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK
Abstract :
A comparison has been made between the use of 2-dimensional, axisymmetric and 3-dimensional geometry in the finite element analysis of a die attach assembly using conductive adhesives. The axisymmetric geometry was found to be a good approximation to the 3-dimensional geometry and gave considerable savings in computer resources and human effort. The true effect of the corners of the square die modelled was, however, not reflected in the stress level predicted by both of the more computationally efficient but simplified 2-dimensional and axisymmetric models
Keywords :
adhesion; finite element analysis; integrated circuit technology; microassembling; packaging; axisymmetric geometry; conductive adhesives; die attach assembly; electronic interconnect structures; finite element analysis; modelling methods; square die; stress level; three-dimensional geometry; two-dimensional geometry; Assembly; Boundary conditions; Computational geometry; Conductive adhesives; Finite element methods; Manufacturing; Microassembly; Predictive models; Solid modeling; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346750
