Title :
Improvements in index alignment method for laser-fiber array packaging
Author :
Cohen, M.S. ; Defranza, M.J. ; Canora, F.J. ; Cina, M.F. ; Rand, R.A. ; Hoh, P.D.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
An “index alignment” method, based on the registration of fiducial marks, was previously developed for passive alignment of a laser array to a corresponding fiber array. This method has recently been improved and used to fabricate laser-fiber array transmitter modules for single-mode operation at 1300 nm. An improved computer-controlled alignment-stage system with machine-vision features has been installed in order to render the alignment procedure faster, more precise, and more reliable; this system was particularly effective in quick achievement of the difficult but necessary angular alignment of the components. Special “self-registration” component-fabrication techniques were also developed to avoid mask-registration errors associated with the fabrication of the laser chip and the fiber carrier, so that the fiducial marks were automatically keyed to the positions of the laser ridges and V grooves, respectively. Measures were also taken to improve the accuracy of alignment of the etch mask to the silicon crystallographic axes during fiber-carrier fabrication, and to improve the etch-stop indication process. These techniques permitted an estimated accuracy and wafer-scale uniformity of ~±0.5 μm of the fiber-carrier V-groove widths. In addition, the essential elements of of a practical technique for separation of a large-array laser-fiber module into a multiplicity of small-array submodules was demonstrated; in this way the cost of the alignment procedure could be amortized over a large number of transmitter modules. Several connectorized laser-fiber array modules were fabricated with the improved alignment apparatus and components. Test results showed that for single-mode operation at 1300 nm, coupling efficiencies greater than 8% could be achieved for a laser-fiber spacing of about 35 μm. Such values closely approach the 9% coupling efficiency observed at this spacing with active alignment. Tests of the completed module at 1 Gb/s showed values of RIN low enough to permit operation at distances of about 1 km
Keywords :
modules; optical fibre fabrication; packaging; semiconductor laser arrays; 1 Gbit/s; 1 km; 1300 nm; 8 percent; RIN; V grooves; angular alignment; computer-controlled alignment-stage; connectorized laser-fiber array transmitter modules; coupling efficiencies; etch mask; etch-stop; fiber array; fiber carrier; fiducial marks; index alignment; laser array; laser chip; laser ridges; machine-vision; mask-registration errors; packaging; passive alignment; self-registration component fabrication; single-mode operation; submodules; Computer errors; Crystallography; Etching; Fiber lasers; Optical arrays; Optical device fabrication; Semiconductor device measurement; Silicon; Testing; Transmitters;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346756