Title :
Packaging and reliability of photonic components for subscriber network systems
Author :
Yoshida, Junichi ; Yamada, Yasufumi ; Terui, Hiroshi
Author_Institution :
NTT Opto-Electron. Labs., Ibaraki, Japan
Abstract :
This paper describes packaging of photonic components called planar lightwave circuit (PLC) optical waveguides on a silicon substrate, using a UV-curable epoxy adhesive, and reliability test results on two types of photonic integrated components; optical coupler module and WDM optical transmitter/receiver module. These modules exhibited good stability after high humidity stress tests or temperature cycle stress tests
Keywords :
integrated optics; optical communication equipment; optical couplers; optical fibres; optical links; optical receivers; optical waveguides; packaging; subscriber loops; wavelength division multiplexing; UV-curable epoxy adhesive; WDM optical transmitter/receiver module; high humidity stress tests; optical coupler module; optical waveguides; packaging; photonic components; photonic integrated components; planar lightwave circuit; reliability; reliability test; stability; subscriber network systems; temperature cycle stress tests; Circuit testing; Integrated circuit reliability; Integrated optics; Optical devices; Optical receivers; Optical transmitters; Optical waveguides; Packaging; Programmable control; Stress;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346760
