• DocumentCode
    2306335
  • Title

    Optimization of Preparation of Corn Starch Phosphates of High Thermal Viscosity by Response Surface Methodology

  • Author

    Li, Guang-Lei ; Wen, Ping ; Zeng, Jie ; Gao, Hai-Yan

  • Author_Institution
    Sch. of Food Sci., Henan Inst. of Sci. & Technol., Xinxiang, China
  • fYear
    2011
  • fDate
    25-27 April 2011
  • Firstpage
    471
  • Lastpage
    474
  • Abstract
    The preparation of corn starch phosphates which possess height thermal viscosity was optimized in this study. A central composite design of response surface methodology involving phosphate (sodium dihydrogen phosphate and disodium hydrogen phosphate) concentration, ratio of sodium dihydrogen phosphate and disodium hydrogen phosphate, phosphorylation temperature and urea concentration was used, and second-order model for thermal viscosity was employed to generate the response surface. The optimum condition for preparation of corn starch phosphates of high thermal viscosity was as follows: phosphate concentration 4.94%; ratio of sodium dihydrogen phosphate and disodium hydrogen 0.80, phosphorylation temperature 145°C; urea concentration 5.5%. The predicted value for thermal viscosity of corn starch phosphates at the optimum condition was 7652 cP. Experimental verification gave value of 7550±25 cP.
  • Keywords
    materials preparation; response surface methodology; sodium compounds; viscosity; Na2HPO4; NaH2PO4; corn starch phosphates; phosphorylation temperature; response surface methodology; second-order model; temperature 145 degC; thermal viscosity; urea concentration; Analysis of variance; Analytical models; Optimization; Response surface methodology; Temperature measurement; Thermal analysis; Viscosity; corn starch phosphates; response surface methodology; thermal viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information and Computing (ICIC), 2011 Fourth International Conference on
  • Conference_Location
    Phuket Island
  • Print_ISBN
    978-1-61284-688-0
  • Type

    conf

  • DOI
    10.1109/ICIC.2011.90
  • Filename
    5954606