Title :
Anomalous thermal conductivity in regions of non-uniform die attach integrity [MCM]
Author :
Koziarz, Walter A. ; Gilmour, Duane A.
Author_Institution :
Rome Lab., Griffiss AFB, NY, USA
Abstract :
This paper addresses the investigation of hot spots identified during infrared thermal analysis of the thermal test dice in a multichip module and the physical analysis procedures utilized to determine the nature of the mechanism. An apparent enhancement of thermal conductivity in delaminated regions of non-uniform die attach adhesion is detailed.
Keywords :
infrared imaging; integrated circuit packaging; integrated circuit reliability; multichip modules; plastic packaging; temperature distribution; thermal conductivity; anomalous thermal conductivity; delaminated regions; hot spots; infrared thermal analysis; multichip module; nonuniform die attach integrity; thermal conductivity enhancement; thermal test dice; Infrared imaging; Laboratories; Microassembly; Multichip modules; Packaging; Scanning electron microscopy; Temperature; Testing; Thermal conductivity; Welding;
Conference_Titel :
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2031-X
DOI :
10.1109/RELPHY.1995.513662
