Stress related offset voltage shift in a precision operational amplifier

Author

Gee, Stephen ; Doan, Tuc ; Gilbert, Ken

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

755

Lastpage

764

Abstract

In molded DIP packaging die attach stresses and stresses due to the contraction of the molding compound lead to a complex state of stress on the die surface where active device elements are located. This paper summarizes experimentation to reduce the effects of packaging stresses upon offset voltage shift in a precision operational amplifier. Variables examined include circuit location, low stress mold compounds, silicone gel coatings, side braze versus molded DIP assembly and post assembly trim

Keywords

brazing; linear integrated circuits; microassembling; operational amplifiers; packaging; silicones; active device elements; circuit location; die attach stresses; die surface; molded DIP packaging; molding compound contraction; packaging stresses; post assembly trim; precision operational amplifier; side braze; silicone gel coatings; stress related offset voltage shift; Assembly; Circuits; Compressive stress; Electronics packaging; Operational amplifiers; Resistors; Semiconductor device packaging; Semiconductor diodes; Tensile stress; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346764

Filename

346764