Title :
Stress related offset voltage shift in a precision operational amplifier
Author :
Gee, Stephen ; Doan, Tuc ; Gilbert, Ken
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
In molded DIP packaging die attach stresses and stresses due to the contraction of the molding compound lead to a complex state of stress on the die surface where active device elements are located. This paper summarizes experimentation to reduce the effects of packaging stresses upon offset voltage shift in a precision operational amplifier. Variables examined include circuit location, low stress mold compounds, silicone gel coatings, side braze versus molded DIP assembly and post assembly trim
Keywords :
brazing; linear integrated circuits; microassembling; operational amplifiers; packaging; silicones; active device elements; circuit location; die attach stresses; die surface; molded DIP packaging; molding compound contraction; packaging stresses; post assembly trim; precision operational amplifier; side braze; silicone gel coatings; stress related offset voltage shift; Assembly; Circuits; Compressive stress; Electronics packaging; Operational amplifiers; Resistors; Semiconductor device packaging; Semiconductor diodes; Tensile stress; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346764
