Title :
Robust titanate-modified encapsulants for high voltage potting application of multi-chip module
Author :
Wong, C.P. ; McBride, R.
Author_Institution :
AT&T Bell Labs., Princeton, NJ, USA
Abstract :
High voltage gated diode crosspoint (GDX) devices (operational at 375 V) in AT&T´s No. 5ESS, require exceptional protection. Heat curable silicone elastomer appears to be the ideal material for this application. The material formulation includes small amounts of a silane coupling agent which increases material adhesion to the potted hybrid integrated circuit (HIC) structure. However, residual silicone couple agent tends to defuse to outer casings thereby contaminating leads and preventing further lead attach assembly. Titanate modified silicone elastomer was developed which prevents silane coupling agent contamination and also further improves adhesion within the potted structure. This paper begins with a FT-IR GC/MS analyses of the contaminant problem, followed with a chemical application towards the final solution to achieving a robust potted GDX HIC. Furthermore, laser ionization mass spectra analysis (LIMA) was used to elucidate the additional titanate interaction with the potting compound
Keywords :
elastomers; electronic switching systems; encapsulation; hybrid integrated circuits; mass spectroscopic chemical analysis; multichip modules; overvoltage protection; 375 V; FT-IR GC/MS analyses; adhesion; chemical application; contaminant problem; heat curable silicone elastomer; high voltage gated diode crosspoint devices; high voltage potting application; laser ionization mass spectra analysis; lead attach assembly; material adhesion; multi-chip module; outer casings; potted hybrid integrated circuit; potted structure; potting compound; residual silicone couple agent; robust potted GDX HIC; robust titanate-modified encapsulants; silane coupling agent; silane coupling agent contamination; titanate modified silicone elastomer; Adhesives; Assembly; Chemical analysis; Coupling circuits; Diodes; Hybrid integrated circuits; Protection; Robustness; Titanium compounds; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346765