Title :
A piezoresistive sensor chip for measurement of stress in electronic packaging
Author :
Jaeger, Richard C. ; Suhling, Jeffrey C. ; Carey, Martin T. ; Johnson, R. Wayne
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
Abstract :
This paper presents the first experimental results of calibration of the 22.5° “off-axis” rosette. This rosette requires the application of only uniaxial stress for measurement of the three individual piezoresistive coefficients of silicon: π11, π12 and π44. Of even greater potential import. This rosette yields inherently temperature compensated values of the coefficients π44 and πD=(π11 -π12) P-type off-axis rosettes have been characterized as a function of temperature and values for the temperature dependencies of π44 and πD are reported. The coefficients π44 in p-type silicon and π D in n-type silicon are needed for an optimized stress sensor on (100) silicon
Keywords :
calibration; electric sensing devices; elemental semiconductors; integrated circuit technology; integrated circuit testing; packaging; piezoelectric transducers; silicon; stress measurement; (100) Si; Si; calibration; electronic packaging; optimized stress sensor; p-type offaxis rosettes; piezoresistive coefficients; piezoresistive sensor chip; stress measurement; temperature compensated values; uniaxial stress; Calibration; Electronics packaging; Piezoresistance; Semiconductor device measurement; Sensor arrays; Silicon; Stress measurement; Temperature dependence; Temperature sensors; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346775
