DocumentCode
2306743
Title
Fine pitch assembly techniques and processes using reflow soldering
Author
Ganasan, Jaya R. ; Lee, Yick F.
Author_Institution
Crystalaid Manuf. Pty Ltd., Fortitude Valley, Qld., Australia
fYear
1993
fDate
1-4 Jun 1993
Firstpage
606
Lastpage
609
Abstract
The requirements for Fine Pitch Technology (FPT) reflow soldering becoming ever increasing in surface mount assemblies. A good first pass yield can be realistically achieved through the proper implementation and control of reflow processes. In this context the authors discuss reflow options, assembly and defect evaluation
Keywords
assembling; printed circuit manufacture; soldering; surface mount technology; IR defects; SMT; defect evaluation; fine pitch assembly techniques; fine pitch technology; reflow soldering; solder deposition tests; surface mount assemblies; vapour phase defects; Assembly; Australia; Circuits; Electronics industry; Lead; Manufacturing; Packaging; Reflow soldering; Surface-mount technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location
Orlando, FL
Print_ISBN
0-7803-0794-1
Type
conf
DOI
10.1109/ECTC.1993.346786
Filename
346786
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