Title :
Fine pitch assembly techniques and processes using reflow soldering
Author :
Ganasan, Jaya R. ; Lee, Yick F.
Author_Institution :
Crystalaid Manuf. Pty Ltd., Fortitude Valley, Qld., Australia
Abstract :
The requirements for Fine Pitch Technology (FPT) reflow soldering becoming ever increasing in surface mount assemblies. A good first pass yield can be realistically achieved through the proper implementation and control of reflow processes. In this context the authors discuss reflow options, assembly and defect evaluation
Keywords :
assembling; printed circuit manufacture; soldering; surface mount technology; IR defects; SMT; defect evaluation; fine pitch assembly techniques; fine pitch technology; reflow soldering; solder deposition tests; surface mount assemblies; vapour phase defects; Assembly; Australia; Circuits; Electronics industry; Lead; Manufacturing; Packaging; Reflow soldering; Surface-mount technology; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346786
