• DocumentCode
    2306790
  • Title

    Temperature-dependent material characterizations for thin epoxy FR-4/ E-Glass woven laminate

  • Author

    Fu, Chiayu ; Brown, Richard C. ; Ume, Charles

  • Author_Institution
    George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    560
  • Lastpage
    562
  • Abstract
    A rapid and flexible material characterization system is presented. With this computerized testing module, thermally expansional and monotonic tests have been conducted to determine the elastic behavior of thin epoxy FR-4/ E-Glass woven laminates under different temperature levels. In this research the electrical resistance strain gauge technique is used to evaluate the test methods for different material properties. This includes two main steps for each temperature level. First is to test thermal expansions under stress-free conditions and then to test linear elastic constants in two dimensional cases. The thin laminates are assumed to be linear and orthogonal. The temperature-dependent properties of interest are coefficients of thermal expansion (CTEs), Young´s moduli, shear moduli, and Poisson´s ratio. The temperature levels ranged between 23°C and 150°C, which is higher than the glass transition temperature (Tg), 125°C, of the tested material. The setup, the features and the capabilities of the automated material testing system are also discussed
  • Keywords
    Young´s modulus; automatic test equipment; automatic testing; elastic constants; elastic deformation; glass; laminates; materials testing; polymers; strain measurement; thermal expansion; 23 to 150 C; ATE; CTE; Poisson ratio; Young moduli; automated material testing system; coefficient of thermal expansion; computerized testing module; elastic behavior; electrical resistance strain gauge technique; epoxy FR-4/ E-Glass woven laminate; glass transition temperature; linear elastic constants; material characterization system; shear moduli; temperature levels; temperature-dependent material characterizations; test methods; thermal expansion; thin laminates; Capacitive sensors; Conducting materials; Electric resistance; Laminates; Material properties; Materials testing; Temperature distribution; Thermal conductivity; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346789
  • Filename
    346789