DocumentCode :
230684
Title :
Development of microplasma based UV sources using diamond nanostructured cathodes
Author :
Kunuku, Srinivasu ; Shiu-Cheng Lou ; Chulung Chen ; Keh-Chyang Leou ; I-Nan Lin
Author_Institution :
Dept. of Eng. & Syst. Sci., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
fYear :
2014
fDate :
6-10 July 2014
Firstpage :
165
Lastpage :
166
Abstract :
In this study we have developed a near Ultra Violet (NUV) source by using discharge of Ar + N2 gas mixture with employ of DC power source. The cathode materials play vital role in efficiency and lifetime of UV sources, which are attained from micro-discharges of various gas compositions. In the present study, micro discharges are conducted in the cavity, which have been architecture by using cylindrical diamond nanotips cathode and ITO coated glass anode. The NUV emission (330 to 400 nm) from the N2 (C-B transition) observed at pressure of 10 torr by applying the DC power of 30-120 mW. The NUV emissions have collected by optical emission spectrometer. The NUV emission intensities increased as function of power at constant pressure. Moreover the devices tested at low pressures and powers in non-harsh gas environment.
Keywords :
argon; cathodes; diamond; discharges (electric); gas mixtures; glass; indium compounds; nanostructured materials; nitrogen; plasma diagnostics; plasma sources; C; DC power; DC power source; ITO coated glass anode; ITO-SiO2; argon-nitrogen gas mixtures; cathode material; constant pressure; cylindrical diamond nanotips cathode; diamond nanostructured cathodes; gas composition; microdischarge; microplasma based UV sources; near ultraviolet emission source; optical emission spectrometry; power 30 mW to 120 mW; power function; pressure 10 torr; Cathodes; Discharges (electric); Fault location; Indium tin oxide; Optical films; Thickness measurement; Diamond cathodes; Microplasma; Optical emission spectrum; UV Source;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Nanoelectronics Conference (IVNC), 2014 27th International
Conference_Location :
Engelberg
Print_ISBN :
978-1-4799-5306-6
Type :
conf
DOI :
10.1109/IVNC.2014.6894794
Filename :
6894794
Link To Document :
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