Title :
TDDB characterisation of thin SiO/sub 2/ films with bimodal failure populations
Author :
Prendergast, James ; Suehle, John ; Chaparala, Prasad ; Murphy, Eammon ; Stephenson, Malcom
Author_Institution :
Analog Devices Inc., Limerick, Ireland
Abstract :
The paper deals with the extensive characterisation of a 20-nm oxide using multiple wafer fabrication lots. The data generated indicate that the intrinsic wearout properties of the oxide are best modelled by the E model with a field-dependent activation energy and a constant field acceleration factor. Of the 3 lots used in the characterisation one exhibited bimodal characteristics with a large extrinsic population. This allowed the investigation of the extrinsic distribution separately which exhibited a 1/E dependence and a field-dependent activation energy. The paper shows that using censored data for bimodal distributions results in the incorrect model (1/E) being used to predict intrinsic wearout. The paper also shows that in order to differentiate between the two models sample sizes must be run to 100% failure to ensure that true intrinsic wearout has been observed. The characterisation matrix used in the evaluation was very comprehensive and indicates E-fields of 7 MV/cm and below must be used to determine the correct field acceleration model.
Keywords :
MIS structures; dielectric thin films; electric breakdown; failure analysis; silicon compounds; E model; MOS oxide films; SiO/sub 2/; TDDB characterisation; bimodal failure populations; censored data; characterisation matrix; constant field acceleration factor; extrinsic distribution; field acceleration model; field-dependent activation energy; intrinsic wearout properties; multiple wafer fabrication lots; thin SiO/sub 2/ films; Capacitors; Electric breakdown; Failure analysis; Packaging; Particle measurements; Performance evaluation; Silicon; System testing; Temperature distribution; Wafer scale integration;
Conference_Titel :
Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2031-X
DOI :
10.1109/RELPHY.1995.513665