Frequency limitation on an assembled SO8 package

Author

Ndagijimana, F. ; Engdahl, J. ; Ahmadouche, A. ; Chilo, J.

Author_Institution

LEMO-ENSERG, Grenoble, France

fYear

1993

fDate

1-4 Jun 1993

Firstpage

530

Lastpage

535

Abstract

An electrical modelling and simulation concept for high speed assembly including SO8 package and integrated switch is presented. Using the Method of Moments (MoM), electrical parameters are extracted for each part of the whole assembled package, and equivalent circuits are proposed. The resulting global network is analysed using a nodal simulator such as SPICE. Isolation and insertion losses are calculated for a signal frequency up to 5 GHz. From our modelling and simulation results, the influence of the mutual coupling between strips or between the wire bondings are shown, the importance of the path connection to ground is pointed out, then required modifications of the connecting layout can be proposed. Our original concept, demonstrated on the SO8 package, is applicable on any package where the propagation effects can be neglected

Keywords

SPICE; circuit analysis computing; digital simulation; equivalent circuits; lead bonding; numerical analysis; packaging; 5 GHz; SPICE; assembled SO8 package; connecting layout; electrical modelling; electrical parameters; equivalent circuits; frequency limitation; global network; high speed assembly; insertion losses; integrated switch; method of moments; mutual coupling; nodal simulator; path connection; propagation effects; wire bondings; Analytical models; Assembly; Circuit simulation; Equivalent circuits; Frequency; Insertion loss; Moment methods; Packaging; SPICE; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346795

Filename

346795