Title :
A high density pad-on-pad connector utilizing a flexible circuit
Author :
Pokrzywa, R.S. ; Fiacco, V.
Author_Institution :
Technol. Products Div., IBM Corp., Endicott, NY, USA
Abstract :
This paper describes a high density, controlled impedance flexible interconnect system used between daughter cards and a mother board in a coolant immersed environment. Topics presented include connector design, alignment techniques utilized, uniform contact pressure methods, connector assembly and feasibility/reliability testing performed on the connector
Keywords :
assembling; electric connectors; printed circuit accessories; reliability; alignment techniques; connector assembly; connector design; controlled impedance flexible interconnect system; coolant immersed environment; daughter cards/mother board connection; flexible circuit; high density pad-on-pad connector; reliability testing; uniform contact pressure methods; Assembly; Circuit testing; Connectors; Contacts; Control systems; Coolants; Flexible printed circuits; Impedance; Integrated circuit interconnections; Temperature control;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346806
