DocumentCode
2307099
Title
A high density pad-on-pad connector utilizing a flexible circuit
Author
Pokrzywa, R.S. ; Fiacco, V.
Author_Institution
Technol. Products Div., IBM Corp., Endicott, NY, USA
fYear
1993
fDate
1-4 Jun 1993
Firstpage
461
Lastpage
464
Abstract
This paper describes a high density, controlled impedance flexible interconnect system used between daughter cards and a mother board in a coolant immersed environment. Topics presented include connector design, alignment techniques utilized, uniform contact pressure methods, connector assembly and feasibility/reliability testing performed on the connector
Keywords
assembling; electric connectors; printed circuit accessories; reliability; alignment techniques; connector assembly; connector design; controlled impedance flexible interconnect system; coolant immersed environment; daughter cards/mother board connection; flexible circuit; high density pad-on-pad connector; reliability testing; uniform contact pressure methods; Assembly; Circuit testing; Connectors; Contacts; Control systems; Coolants; Flexible printed circuits; Impedance; Integrated circuit interconnections; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location
Orlando, FL
Print_ISBN
0-7803-0794-1
Type
conf
DOI
10.1109/ECTC.1993.346806
Filename
346806
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