Coaxial SMT module connector for high-speed MCM

Author

Sasaki, Shinichi ; Kishimoto, Tohru ; Sugiura, Nobuaki

Author_Institution

Transp. Network Syst. Lab., NTT Commun. Switching Labs., Tokyo, Japan

fYear

1993

fDate

1-4 Jun 1993

Firstpage

446

Lastpage

451

Abstract

This paper describes a trial coaxial surface mounted connector for PGA-type high-speed multichip modules (MCM). An MCM connector is needed to ensure testability and connection reliability of MCMs mounted on a printed circuit board. Our connector consists of a coaxial elements, a common ground housing made of conductive resin, and a ground contact spring plate. It has 68 signal contacts. We investigated the performance of this connector by experiment and simulation. Its insertion force is only about 53 gf per signal pin. The characteristic impedance is from 45.6 Ω to 61.4 Ω. The average resistance between two contacts is 28 mΩ with a deviation of less than plus or minus 5 mΩ. The insertion loss was measured to be -0.4 dB at 1.0 GHz. Crosstalk noise is less than 1.2%. This prototype-connector transmitted pulses of up to 1.2 Gb/s, showing that it is applicable to high-speed MCMs

Keywords

contact resistance; crosstalk; electric connectors; electric impedance; losses; multichip modules; printed circuit accessories; reliability; surface mount technology; -0.4 dB; 1.2 Gbit/s; PCB mounted connector; PGA-type MCM; characteristic impedance; coaxial SMT module connector; coaxial surface mounted connector; common ground housing; conductive resin; connection reliability; crosstalk noise; ground contact spring plate; high-speed MCM application; high-speed multichip modules; insertion force; insertion loss; printed circuit board; Circuit simulation; Circuit testing; Coaxial components; Connectors; Contacts; Multichip modules; Printed circuits; Resins; Springs; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346808

Filename

346808