• DocumentCode
    2307159
  • Title

    A new direction for elastomeric connectors

  • Author

    Beaman, B. ; Shih, D.-Y. ; Walker, G.

  • Author_Institution
    Enterprise Syst. Div., IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    436
  • Lastpage
    440
  • Abstract
    Elastomeric connectors are a relatively new technology compared with conventional connector systems. A wide variety of elastomeric connectors are available today to meet the interconnection requirements for many different electronic packaging applications. Multichip modules are one of the many applications that benefit from the high density interconnection capabilities of elastomeric connectors. The ELASTICON connector is a new high performance elastomeric connector that was developed to address some of the key limitations of existing MCM and land grid array connectors. The ELASTICON connector uses gold or gold alloy wires for the conductive elements embedded in an elastomer material. The size, shape and spacing along with the elastomer material properties can be tailored to specific application requirements. The processes that have been developed for fabricating the ELASTICON connector represent a new direction for elastomeric connector manufacturing. Besides LGA packaging applications, ELASTICON connectors can be used for board-to-board and cable-to-board interconnections as well as high density PCB and IC chip testing applications
  • Keywords
    elastomers; electric connectors; gold; gold alloys; packaging; printed circuit accessories; Au; Au alloy wires; Au wires; ELASTICON; IC chip testing applications; LGA packaging applications; MCM connectors; board-to-board interconnections; cable-to-board interconnections; connector manufacturing; elastomeric connectors; electronic packaging applications; high density PCB testing applications; high density interconnection capabilities; multichip module connectors; Conducting materials; Connectors; Electronics packaging; Gold alloys; LAN interconnection; Manufacturing processes; Material properties; Multichip modules; Shape memory alloys; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346810
  • Filename
    346810