Title :
Slow wave effects induced by the thin-film metal ground in on-chip multilayer microstrip lines
Author :
Zhang, Lu ; Song, Jiming
Author_Institution :
Iowa State Univ., Ames
Abstract :
This paper implements the spectral domain approach (SDA) to study the impacts from the thin metal ground upon dispersive propagation behaviors of interconnects. Three multilayer transmission structures, the thin-film microstrip line (TFMSL), metal-insulator-metal-insulator (MIMI) line, and inverted embedded microstrip (IEM) line, are analyzed with the focus on different metallization thicknesses.
Keywords :
MIM structures; integrated circuit interconnections; integrated circuit metallisation; microstrip lines; spectral-domain analysis; EM leakage; backside thin-film metallization; interconnects; inverted embedded microstrip line; magnetic field; metal-insulator-metal-insulator line; on-chip multilayer microstrip lines; propagation characteristics; skin depth; slow wave effects; spectral domain approach; thin film microstrip line; thin-film metal ground; thin-film metallization; transmission line structures; Microstrip; Nonhomogeneous media; Transistors;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2007 IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-0877-1
Electronic_ISBN :
978-1-4244-0878-8
DOI :
10.1109/APS.2007.4395532
