DocumentCode :
2307175
Title :
An aluminum nitride package for 300°C operation
Author :
Bloom, Terfy R.
Author_Institution :
Corp. Office, CTS Corp., Elkhart, IN, USA
fYear :
1993
fDate :
1-4 Jun 1993
Firstpage :
431
Lastpage :
435
Abstract :
There has long been a need for electronics that can operate at high temperatures. Applications that could make use of 300°C packages include deep well drilling sensors and the direct mounting of packages to high temperature engines of all types. Only recently have IC chips been developed that can survive continuous operating temperatures up to 300°C. Unfortunately, current packaging technology cannot handle these high temperatures. This paper will detail a packaging technique that will survive continuous operating temperatures up to 300°C
Keywords :
aluminium compounds; circuit reliability; high-temperature techniques; integrated circuit technology; packaging; thermal analysis; 300 C; AlN; IC chip package; high temperature operation; interconnect reliability; thermal factors; Aluminum nitride; Circuits; Dielectric substrates; Nickel; Packaging; Seals; Silver; Temperature; Thermal expansion; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
Type :
conf
DOI :
10.1109/ECTC.1993.346811
Filename :
346811
Link To Document :
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