• DocumentCode
    2307175
  • Title

    An aluminum nitride package for 300°C operation

  • Author

    Bloom, Terfy R.

  • Author_Institution
    Corp. Office, CTS Corp., Elkhart, IN, USA
  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    431
  • Lastpage
    435
  • Abstract
    There has long been a need for electronics that can operate at high temperatures. Applications that could make use of 300°C packages include deep well drilling sensors and the direct mounting of packages to high temperature engines of all types. Only recently have IC chips been developed that can survive continuous operating temperatures up to 300°C. Unfortunately, current packaging technology cannot handle these high temperatures. This paper will detail a packaging technique that will survive continuous operating temperatures up to 300°C
  • Keywords
    aluminium compounds; circuit reliability; high-temperature techniques; integrated circuit technology; packaging; thermal analysis; 300 C; AlN; IC chip package; high temperature operation; interconnect reliability; thermal factors; Aluminum nitride; Circuits; Dielectric substrates; Nickel; Packaging; Seals; Silver; Temperature; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346811
  • Filename
    346811