DocumentCode
2307175
Title
An aluminum nitride package for 300°C operation
Author
Bloom, Terfy R.
Author_Institution
Corp. Office, CTS Corp., Elkhart, IN, USA
fYear
1993
fDate
1-4 Jun 1993
Firstpage
431
Lastpage
435
Abstract
There has long been a need for electronics that can operate at high temperatures. Applications that could make use of 300°C packages include deep well drilling sensors and the direct mounting of packages to high temperature engines of all types. Only recently have IC chips been developed that can survive continuous operating temperatures up to 300°C. Unfortunately, current packaging technology cannot handle these high temperatures. This paper will detail a packaging technique that will survive continuous operating temperatures up to 300°C
Keywords
aluminium compounds; circuit reliability; high-temperature techniques; integrated circuit technology; packaging; thermal analysis; 300 C; AlN; IC chip package; high temperature operation; interconnect reliability; thermal factors; Aluminum nitride; Circuits; Dielectric substrates; Nickel; Packaging; Seals; Silver; Temperature; Thermal expansion; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location
Orlando, FL
Print_ISBN
0-7803-0794-1
Type
conf
DOI
10.1109/ECTC.1993.346811
Filename
346811
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