Effects of mechanical and flow properties of encapsulating resin on the performance of ultra thin tape carrier package

Author

Nakamura, Yoshinobu ; Ohta, Mutsuko ; Nishioka, Tsutomu ; Tanaka, Atsushi ; Ohizumi, S.-i. ; Tabata, H. ; Kohmoto, Michio

Author_Institution

Central Res. Lab., Nitto Denko Corp., Osaka, Japan

fYear

1993

fDate

1-4 Jun 1993

Firstpage

419

Lastpage

424

Abstract

A new ultra thin tape carrier package (TCP) for memory card was developed to meet demands for smaller and thinner TSOP. The thickness of package and Si chip are 0.4 and 0.2 mm, respectively. In order to achieve thin packages, the technology of tape automated bonding (TAB) is required. Nitto´s transfer molding technology is used to obtain the same level of both reliability and conventional reflow solderability as those of other surface mount devices (SMDs). The upper and side surface of the Si chip are encapsulated with resin, but the bottom surface is still exposed. In this paper, four kinds of epoxy encapsulating resins with different filler volume fractions were prepared to obtain various mechanical and flow properties. The effects of the coefficient of thermal expansion and viscosity of the encapsulating resin on the performance of the new ultra thin packages are studied

Keywords

deformation; encapsulation; finite element analysis; integrated circuit technology; mechanical properties of substances; polymer films; surface mount technology; tape automated bonding; thermal expansion; thermal stress cracking; viscosity; voids (solid); 0.2 mm; 0.4 mm; FEM; SMD; SMT; Si; Si chip encapsulation; TAB; TSOP; coefficient of thermal expansion; encapsulating resin; epoxy encapsulating resins; finite element method; flow properties; mechanical properties; memory card application; package cracking; package warpage; solder reflow process; surface mount devices; tape automated bonding; thin SOP; transfer molding technology; ultra thin tape carrier package; viscosity; Acoustic measurements; Bonding; Electronic packaging thermal management; Electronics packaging; Laboratories; Mechanical factors; Resins; Surface-mount technology; Transfer molding; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346813

Filename

346813