Title :
Analysis and resolution of vibration induced wire breaks in MQUAD cavity packages
Author :
Hoffman, Paul ; Kriss, Mark
Author_Institution :
Olin Interconnect Technol., Manteca, CA, USA
Abstract :
Wire breaks near the second bond in MQUAD packages were found to be caused by a board depanelling process that used a high speed router. The router caused board vibrations that were transmitted to the internal cantilevered package leads. Reducing the cantilevered lead length, so that the lead resonant frequency is increased and the lead tip deflection is decreased effectively eliminates the wire breaks
Keywords :
dynamic testing; integrated circuit technology; packaging; resonance; vibrations; MQUAD cavity packages; board depanelling process; cantilevered lead length reduction; high speed router; internal cantilevered package leads; lead resonant frequency; lead tip deflection; vibration induced wire breaks; wire breaks elimination; Application specific integrated circuits; Bonding; Electronics packaging; Lead compounds; Plastic packaging; Routing; Semiconductor device packaging; Testing; Vibration measurement; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346814
